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INTEGRATED CIRCUITS
DATA SHEET
PCF8570 256 x 8-bit static low-voltage RAM with I2C-bus interface
Product specification Supersedes data of 1997 Sep 02 File under Integrated Circuits, IC12 1999 Jan 06
Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 8.3 8.4 8.5 9 10 11 12 13 13.1 13.2 13.3 14 15 15.1 15.2 15.2.1 15.2.2 15.3 15.3.1 15.3.2 15.3.3 15.4 16 17 18 FEATURES APPLICATIONS GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING CHARACTERISTICS OF THE I2C-BUS Bit transfer Start and stop conditions System configuration Acknowledge I2C-bus protocol LIMITING VALUES HANDLING DC CHARACTERISTICS AC CHARACTERISTICS APPLICATION INFORMATION Application example Slave address Power-saving mode PACKAGE OUTLINES SOLDERING Introduction Through-hole mount packages Soldering by dipping or by solder wave Manual soldering Surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of IC packages for wave, reflow and dipping soldering methods DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS
PCF8570
1999 Jan 06
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Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
1 FEATURES
PCF8570
* Operating supply voltage 2.5 to 6.0 V * Low data retention voltage; minimum 1.0 V * Low standby current; maximum 15 A * Power-saving mode; typical 50 nA * Serial input/output bus (I2C-bus) * Address by 3 hardware address pins * Automatic word address incrementing * Available in DIP8 and SO8 packages. 2 APPLICATIONS 3 GENERAL DESCRIPTION The PCF8570 is a low power static CMOS RAM, organized as 256 words by 8-bits. Addresses and data are transferred serially via a two-line bidirectional bus (I2C-bus). The built-in word address register is incremented automatically after each written or read data byte. Three address pins, A0, A1 and A2 are used to define the hardware address, allowing the use of up to 8 devices connected to the bus without additional hardware.
* Telephony: - RAM expansion for stored numbers in repertory dialling (e.g. PCD33xxA applications) * General purpose RAM for applications requiring extremely low current and low-voltage RAM retention, such as battery or capacitor-backed. * Radio, television and video cassette recorder: - channel presets * General purpose: - RAM expansion for the microcontroller families PCD33xxA, PCF84CxxxA, P80CLxxx and most other microcontrollers. 4 QUICK REFERENCE DATA SYMBOL VDD IDD IDDR Tamb Tstg 5 supply voltage supply current (standby) supply current (power-saving mode) operating ambient temperature storage temperature PARAMETER
CONDITIONS fSCL = 0 Hz Tamb = 25 C
MIN. 2.5 - - -40 -65
MAX. 6.0 15 400 +85 +150
UNIT A nA C C
ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DIP8 SO8 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 8 leads; body width 7.5 mm VERSION SOT97-1 SOT176-1
PCF8570P PCF8570T
1999 Jan 06
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Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
6 BLOCK DIAGRAM
PCF8570
handbook, full pagewidth
PCF8570
A0 A1 A2 SCL SDA 5 1 2 3 6 INPUT FILTER
WORD ADDRESS REGISTER
7
ROW SELECT
MEMORY CELL ARRAY
I C BUS CONTROL
2
COLUMN SELECT
MULTIPLEXER
VDD VSS TEST
8 4 7
POWER ON RESET
SHIFT REGISTER
8
R/W CONTROL
MLB928
Fig.1 Block diagram.
7
PINNING SYMBOL PIN 1 2 3 4 5 6 7 DESCRIPTION hardware address input 0 hardware address input 1 hardware address input 2 negative supply serial data input/output serial clock input Input for power-saving mode (see section "Power-saving mode"). Also used as a test output during manufacture. TEST should be tied to VSS during normal operation. positive supply
page
A0 A1 A2 VSS SDA SCL TEST
A0 A1 A2 VSS
1 2
8 7
VDD TEST SCL SDA
PCF8570
3 4
MLB929
6 5
VDD
8
Fig.2 Pin configuration.
1999 Jan 06
4
Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
8 CHARACTERISTICS OF THE I2C-BUS 8.1 Bit transfer
PCF8570
The I2C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data transfer may be initiated only when the bus is not busy.
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as a control signal.
SDA
SCL data line stable; data valid change of data allowed
MBA607
Fig.3 Bit transfer.
8.2
Start and stop conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the stop condition (P).
SDA
SDA
SCL S START condition P STOP condition
SCL
MBA608
Fig.4 Definition of start and stop conditions.
1999 Jan 06
5
Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
8.3 System configuration
PCF8570
A device generating a message is a `transmitter', a device receiving a message is the `receiver'. The device that controls the message is the `master' and the devices which are controlled by the master are the `slaves'.
SDA SCL MASTER TRANSMITTER / RECEIVER SLAVE TRANSMITTER / RECEIVER MASTER TRANSMITTER / RECEIVER
MBA605
SLAVE RECEIVER
MASTER TRANSMITTER
Fig.5 System configuration.
8.4
Acknowledge
The number of data bytes transferred between the start and stop conditions from transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge bit. The acknowledge bit is a HIGH level signal put on the bus by the transmitter during which time the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter.
The device that acknowledges must pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse (set-up and hold times must be taken into consideration). A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a stop condition.
handbook, full pagewidth
START condition SCL FROM MASTER 1 2 8
clock pulse for acknowledgement 9
DATA OUTPUT BY TRANSMITTER S DATA OUTPUT BY RECEIVER
MBA606 - 1
Fig.6 Acknowledgement on the I2C-bus.
1999 Jan 06
6
Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
8.5 I2C-bus protocol
PCF8570
Before any data is transmitted on the I2C-bus, the device which should respond is addressed first. The addressing is always carried out with the first byte transmitted after the start procedure. The I2C-bus configuration for the different PCF8570 WRITE and READ cycles is shown in Figs 7, 8 and 9.
handbook, full pagewidth
acknowledgement from slave
acknowledgement from slave
acknowledgement from slave
S
SLAVE ADDRESS
0A
WORD ADDRESS
A
DATA
A
P
R/W
n bytes auto increment memory word address
MBD822
Fig.7 Master transmits to slave receiver (WRITE) mode.
handbook, full pagewidth
acknowledgement from slave
acknowledgement from slave
acknowledgement from slave
acknowledgement from master
S
SLAVE ADDRESS
0A
WORD ADDRESS
A
S
SLAVE ADDRESS
1A
DATA
A
R/W
at this moment master transmitter becomes master - receiver and PCF8570 slave receiver becomes slave - transmitter
R/W
n bytes auto increment memory word address
no acknowledgement from master
DATA
1
P
last byte
MLB930
auto increment memory word address
Fig.8 Master reads after setting word address (WRITE word address; READ data).
1999 Jan 06
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Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
PCF8570
andbook, full pagewidth
acknowledgement from slave
acknowledgement from slave
acknowledgement from slave
S
SLAVE ADDRESS
1A
DATA
A
DATA
1
P
R/W
n bytes auto increment word address
last bytes auto increment word address
MBD824
Fig.9 Master reads slave immediately after first byte (READ mode).
9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI II IO IDD ISS Ptot PO Tamb Tstg supply voltage (pin 8) input voltage (any input) DC input current DC output current positive supply current negative supply current total power dissipation per package power dissipation per output operating ambient temperature storage temperature PARAMETER MIN. -0.8 -0.8 - - - - - - -40 -65 MAX. +8.0 VDD + 0.8 10 10 50 50 300 50 +85 +150 V V mA mA mA mA mW mW C C UNIT
10 HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under "Handling MOS Devices".
1999 Jan 06
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Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
11 DC CHARACTERISTICS VDD = 2.5 to 6.0 V; VSS = 0 V; Tamb = -40 to +85 C; unless otherwise specified. SYMBOL Supply VDD IDD supply voltage supply current standby mode VI = VDD or VSS; fSCL = 0 Hz; Tamb = -25 to +70 C VI = VDD or VSS; fSCL = 100 Hz note 1 - - 5 2.5 - 6.0 PARAMETER CONDITIONS MIN. TYP.
PCF8570
MAX.
UNIT
V A
operating mode VPOR VIL VIH IOL ILI ILI Ci Power-on reset voltage
- 1.5 -0.8 0.7VDD 3 -1 -250 -
- 1.9 - - - - - - - - -
200 2.3
A V
Inputs, input/output SDA LOW level input voltage HIGH level input voltage LOW level output current input leakage current note 2 note 2 VOL = 0.4 V VI = VDD or VSS VI = VDD or VSS VI = VSS 0.3VDD - +1 V mA A VDD + 0.8 V
Inputs A0, A1, A2 and TEST input leakage current +250 nA
Inputs SCL and SDA input capacitance 7 pF
Low VDD data retention VDDR IDDR supply voltage for data retention supply current VDDR = 1 V VDDR = 1 V; Tamb = -25 to +70 C Power-saving mode (see Figs 13 and 14) IDDR tHD2 Notes 1. The Power-on reset circuit resets the I2C-bus logic when VDD < VPOR. The status of the device after a Power-on reset condition can be tested by sending the slave address and testing the acknowledge bit. 2. If the input voltages are a diode voltage above or below the supply voltage VDD or VSS an input current will flow; this current must not exceed 0.5 mA. supply current recovery time TEST = VDD; Tamb = 25 C - - 50 50 400 - nA s 1 - - 6 5 2 V A A
1999 Jan 06
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Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
PCF8570
12 AC CHARACTERISTICS All timing values are valid within the operating supply voltage and ambient temperature range and reference to VIL and VIH with an input voltage swing of VSS to VDD. SYMBOL I2C-bus timing (see Fig.10; note 1) fSCL tSP tBUF tSU;STA tHD;STA tLOW tHIGH tr tf tSU;DAT tHD;DAT tVD;DAT tSU;STO Note 1. A detailed description of the I2C-bus specification, with applications, is given in brochure "The I2C-bus and how to use it". This brochure may be ordered using the code 9398 393 40011. SCL clock frequency tolerable spike width on bus bus free time START condition set-up time START condition hold time SCL LOW time SCL HIGH time SCL and SDA rise time SCL and SDA fall time data set-up time data hold time SCL LOW-to-data out valid STOP condition set-up time - - 4.7 4.7 4.0 4.7 4.0 - - 250 0 - 4.0 - - - - - - - - - - - - - 100 100 - - - - - 1.0 0.3 - - 3.4 - kHz ns s s s s s s s ns ns s s PARAMETER MIN. TYP. MAX. UNIT
handbook, full pagewidth
PROTOCOL
START CONDITION (S)
BIT 7 MSB (A7)
BIT 6 (A6)
BIT 0 LSB (R/W)
ACKNOWLEDGE (A)
STOP CONDITION (P)
t SU;STA
t LOW
t HIGH
1 / f SCL
SCL
t
BUF
tr
t
f
SDA
t HD;STA
t SU;DAT
t
HD;DAT
t VD;DAT
MBD820
t SU;STO
Fig.10 I2C-bus timing diagram; rise and fall times refer to VIL and VIH.
1999 Jan 06
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Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
13 APPLICATION INFORMATION 13.1 Application example
PCF8570
handbook, full pagewidth
VDD
SDA
MASTER TRANSMITTER/ RECEIVER SCL
VDD
0 0 0
A0 A1 A2 TEST
SCL
PCF8570
'1010' V SS SDA
VDD
VDD
1 0 0
A0 A1 A2 TEST
SCL
up to 8 PCF8570C
PCF8570
'1010' V SS SDA
V DD
VDD VDD VDD
1 1 1
A0 A1 A2 TEST
SCL
PCF8570
'1010' V SS SDA R R R: pull up resistor tr R= C BUS
MLB931
V DD
SDA
SCL
(I 2 C bus)
It is recommended that a 4.7 F/10 V solid aluminium capacitor (SAL) be connected between VDD and VSS.
Fig.11 Application diagram.
1999 Jan 06
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Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
13.2 Slave address
PCF8570
The PCF8570 has a fixed combination 1 0 1 0 as group 1, while group 2 is fully programmable (see Fig.12).
handbook, halfpage
1
0
1
0
A2
A1
A0 R/W
group 1
group 2
MLB892
Fig.12 Slave address.
13.3
Power-saving mode
With the condition TEST = VDD or VDDR the PCF8570 goes into the power-saving mode and I2C-bus logic is reset.
handbook, full pagewidth
power saving mode (1) TEST = VDDR
operating mode
power saving mode (2) TEST = VDD
VDD
TEST
SCL
SDA
,, ,, ,, ,,
t SU (3)
,,, ,,, ,,, ,,,
t HD1 (3)
t SU (3)
,,, ,,, ,,, ,,,
t HD2 (3)
MLB932
VDDR 0V VDD VDDR 0V VDD VDDR 0V VDD VDDR 0V I DD
VDD
I DD I DDS
(1) Power-saving mode without 5 V supply voltage. (2) Power-saving mode with 5 V supply voltage. (3) tSU and tHD1 4 s and tHD2 50 s.
Fig.13 Timing for power-saving mode.
1999 Jan 06
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Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
PCF8570
handbook, full pagewidth
5V VDD SDA SCL 8 5 6 3 A2 A1 VDDR 1.2 V (NiCd)
PCF8570
2
MICROCONTROLLER
TEST
(1)
7 4 VSS
1
A0
MLB933
It is recommended that a 4.7 F/10 V solid aluminium capacitor (SAL) be connected between VDD and VSS. (1) In the operating mode TEST = 0 V; in the power-saving mode TEST = VDDR.
Fig.14 Application example for power-saving mode.
1999 Jan 06
13
Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
14 PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil)
PCF8570
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001AN EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
1999 Jan 06
14
Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
PCF8570
SO8: plastic small outline package; 8 leads; body width 7.5 mm
SOT176-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp L 1 e bp 4 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 7.65 7.45 0.30 0.29 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.45 Lp 1.1 0.45 0.043 0.018 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 2.0 1.8 0.079 0.071
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.057 0.394
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT176-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-25 97-05-22
1999 Jan 06
15
Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
15 SOLDERING 15.1 Introduction
PCF8570
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. 15.3.2 WAVE SOLDERING
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. 15.2 15.2.1 Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 15.3.3 MANUAL SOLDERING
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 15.2.2 MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 15.3 15.3.1 Surface mount packages REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 1999 Jan 06 16
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
15.4 Suitability of IC packages for wave, reflow and dipping soldering methods
PCF8570
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not not not suitable(3) recommended(4)(5) recommended(6) suitable REFLOW(1) - suitable suitable suitable suitable suitable - - - - - DIPPING suitable
1999 Jan 06
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Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
16 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCF8570
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 17 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 18 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1999 Jan 06
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Philips Semiconductors
Product specification
256 x 8-bit static low-voltage RAM with I2C-bus interface
NOTES
PCF8570
1999 Jan 06
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 489 4339/4239, Fax. +30 1 481 4240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777 Internet: http://www.semiconductors.philips.com
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
415106/00/04/pp20
Date of release: 1999 Jan 06
Document order number:
9397 750 04971

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